Châssis Woodward 5453-759 MicroNet-Plus à 14 emplacements

Description：

The Woodward 5453-279 is a Triple Modular Redundant (TMR) Main Chassis developed for critical applications requiring high reliability and fault tolerance. It serves as the core structure in a TMR system, providing slots for kernel power supplies, CPUs, and up to twelve I/O modules. Designed for both expansion and robustness, this chassis is adaptable to different processors and ensures consistent, uninterrupted operation even in demanding environments.

Specifications:

• Part Number: 5453-279
• Manufacturer: Woodward
• Product Type: MicroNet TMR Chassis
• Country of Manufacture: United States (USA)
• Availability: In Stock

Features:

• TMR System Integration:

  • Supports both TMR5200 and TMR040 processors, which dictate how I/O expansion is managed.
  • TMR5200 Processor: Allows shared I/O through RTN (Redundant Trunk Network) networks, enabling up to three additional I/O chassis.
  • TMR040 Processor: Utilizes dedicated I/O connections with transceivers and cables, where each CPU has exclusive control over its assigned I/O resources.

• Kernel Power Supplies:

  • Dedicated slots for kernel power supply modules, crucial for powering the system components, ensuring compatibility with the selected CPU.

• CPU Accommodation:

  • Provides slots for central processing units (CPUs), which perform computations and manage key tasks within the TMR system, ensuring high-performance control and fault-tolerant operation.

• I/O Module Capacity:

  • Can accommodate up to twelve I/O modules, handling a variety of input and output operations, facilitating smooth interaction between the system and external devices, sensors, and interfaces.

• Expansion Capabilities:

  • The expansion capability depends on the processor in use:
    • With TMR5200 processors, the system can expand to up to three I/O chassis via RTN networks, treating the modules as Shared I/O.
    • With TMR040 processors, I/O expansion uses Transceiver modules and copper or fiber cables to link multiple chassis, with I/O resources dedicated to individual CPUs.